The Dieline Package Design Conference is a new design conference addressing the challenges and opportunities unique to packaging designers.
The event will take place June 22 - 24 in Chicago, in conjunction with HOW Design Live.
The Dieline Package Design Conference will combine The Dieline's close knowledge of the packaging design community with HOW's long history of providing targeted education, inspiration and networking opportunities to designers of all stripes.
The prestigious 2011 The Dieline Awards Ceremony will take place at the conference, and a gallery of the winning packaging will be available for viewing.